Effect of stand‑of height on the shear strength of ball grid array solder joints under varying pad sizes

Ogunsemi, Bamidele T. and Ikubanni, Peter P. and Adediran, Adeolu A. and Agboola, Olayinka O. Effect of stand‑of height on the shear strength of ball grid array solder joints under varying pad sizes. SN Applied Sciences (Springer Nature), 1 (32).

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Abstract

The solder joints of ball grid array utilized in consumer electronics systems or assemblies degrade and fail overtime. Their degree of degradation is more critical, especially at elevated temperatures and mechanical loading conditions. This study presents the efect of component standof height (CSH) on the shear strength reliability of ball grid array solder joints under diferent pad sizes. Investigation of the impact of standof height on the mechanical reliability of the solder joint of ball grid array components under diferent pad sizes was conducted in this work. Isothermal ageing of test samples were conducted at 150 °C for 8 days. This study focuses on establishing the relationship between CSH and shear strength of the solder joints under diferent pad sizes and the corresponding efect of prolonged elevated temperature conditions on the mechanical integrity of the soldered joints. The work also identifes the failure mode and examines the region of the failed joints and surfaces to provide information on the morphological characteristics of the material microstructure. The results of this study demonstrate that the smallest pad size (19 mil) gave the lowest shear strength of 61.08 MPa with a high standof height of 0.25 mm as compared to the largest pad size (24 mil) with the highest shear strength of 70.43 MPa having a relatively low standof height of 0.22 mm

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